» Silicon wafer shaping for Astronomical X-ray Optics: plastic vs. elastic deformation

Presentation duration: 15 minutes

Presenter: Rene Hudec

Polished wafer from monocrystalline silicon available in semiconductor industry has thickness homogeneity of tenths of micrometer and surface roughness of tenths of nanometer. The possible utilization of silicon wafers for mirrors in astronomical x-ray optics is dependent on the possibility to precisely shape them without surface deterioration. One of the proposed solutions is lightweight optics based on self supporting wafers. We present comparison of two shaping methods: plastic deformation and the use of thin layers with intrinsic stress. Advantages and disadvantages of both methods are discussed.

J. Sik

R. Lenhard