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» Protection of Si wafers surfase during cutting
Presenter: Martina Landová
In this experiment we cut the Si wafer for x-ray telescopes by laser beam into peaces of required size. During cutting and experiments we protect the Si wafer surface by polymeric foil. We investigate surfece of Si wafer by AFM and optical microscopy before use of polymer and after cutting.
Coauthors:- Martina Landová, Libor Švéda, Veronika Maršíková
