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01. 12. 2008
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42 participants registered already

Important dates
Conference:
2-6 December 2008
Registration deadline:
5 November 2008
Location

Presentation details

» Advanced Si wafers for X-ray telescopes

Presentation duration: 20 minutes

Presenter: Jan Šik

Future X-ray telescopes require precise and light-weight X-ray optics. Novel approaches are employed to find suitable substrates for mirrors, i.e., to achieve required geometries with the fine surface micro-roughness. Some proposed solutions are based on commercially available silicon wafers manufactured for semiconductor industry. Relatively light and circular shaped wafers are commercially produced in diameters of 100 - 300 mm with the thickness of 380 - 780 µm. During the manufacturing process, wafer is lapped or ground to obtain parallel surfaces with thickness homogeneity better than 1 µm and finally polished to mirror-like surface with very low micro-roughness of 0.1 - 0.2 nm. To achieve these parameters, the production of Si wafers needs to be optimized.

Authors:
Jan Sik
Coauthors:
Michal Lorenc
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